Lead the development of next-generation silicon direct cooling technologies vis-à-vis Micro Channel Lid or Direct Silicon cooling to enable higher-performance computing platforms, collaborating closely with cross-functional engineering teams and external ecosystem partners including semiconductor packaging providers, silicon/ASIC vendors, and system integrators (ODMs).
Drive thermal management innovation across platforms ranging from general-purpose servers to advanced GPU systems, while demonstrating technical leadership in packaging technologies to address increasingly complex cooling challenges driven by rising compute density and power requirements
Key Objectives & Success Measures
Develop strong partnerships with external compute systems that are pertinent to the program
Negotiate for win-win on terms and conditions with internal and external partners
Define short and long-term milestones with all parties
Flawlessly execute the agreed upon milestones and track progress
Develop key IPs for CoolIT where possible to strengthen our foothold in this field
Key Responsibilities
Technical Development & Leadership
Build out the internal and external support infrastructure for this new MCL and direct cooling technology
Act as the key POC for external packaging companies, silicon vendors, and system integrator including OEMs and/or ODMs
Lead by influence by clearly articulating the vision of this technology
Technical Customer Engagement
Act as the primary technical interface for this micro-channel lid or direct cooling technology to engage customers while partnering closely with internal teams
Sensitize and translate partners’ and customers’ requests and pain points into actionable items to drive solution
Support design reviews, technical enablement, failure analysis, and customer engagement
Understanding of customers’ and silicon roadmap to determine how CoolIT’s technical capability can provide value
Partner Management
Build strong relationships across internal functional organizations: Advanced Technology Group, Coldplate engineering, and/or CDU engineering.
Partner with our manufacturing operations to ensure CoolIT’s products are built with DFx (DFM, DFS, DFT, etc) in mind
Preferred
Master of Science degree in related discipline with background in electronic packaging, chip package designs and/or chip cooling solution.
Prior experience in electronic packaging industry and/or chip design industry
Established relationships within OSATs, ODMs and/or chip vendors
Skills & Attributes
Highly analytical and strategic thinker with quality and reliability of product in mind
Skilled in DFx (x = manufacturability, reliability, and/or test)
Comfortable in operating with ambiguity in fast‑evolving technology markets
Excellent communication skills in English; Mandarin proficiency strongly preferred
Our Commitment to a Culture of Inclusion & Belonging
Ecolab is committed to fair and equal treatment of associates and applicants and furthering the principles of Equal Opportunity to Employment. We will recruit, hire, promote, transfer and provide opportunities for advancement based on individual qualifications and job performance in all matters affecting employment, compensation, benefits, working conditions, and opportunities for advancement. Ecolab will not discriminate against any associate or applicant for employment because of race, religion, color, creed, national origin,citizenship status, sex, sexual orientation, gender identity and expressions, genetic information, marital status, age, or disability.
